TEARDOWN & REVERSE ENGINEERING
We tear down electronics products such as smartphones, televisions, wearables, peripherals, etc. to reveal the internal circuity and IC packages that implement core functionalities of the products. Identifying each chip in the products helps our client conduct litigation discovery in the right direction as well as improve technical accuracy of their damages/royalty calculation.
Our engineers use state of the art RE techniques to decapsulate IC packages in order to reveal the technology and materials used in fabricating a given chip - as well as the general blueprint and major component blocks inside the chip. For many types of chips, we can perform active probe testing as well to show how these component blocks react to certain signals.
In order to reveal the true structure of an IC chip, our engineers employ Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM) and other similar techniques to show each individual layer in the chip. We partner with the leading testing laboratories across the country in order to leverage the best tools and the best expertise required for understanding and documenting the internal structure - while keeping costs of discovery low for the client.
Know more about how we leverage different RE techniques to uncover even the hardest to find evidence of patent infringement: