Copperpod welcomes Sukhdeep Singh to the Operations Team

New York, NY: On 14th February, 2022, Copperpod IP announced that Sukhdeep Singh will be joining the company as a Research Analyst - II. The team at Copperpod IP is excited to welcome Sukhdeep in the operations team

Sukhdeep is a seasoned IP professional with more than 3 years of experience in handling IP related projects, such as novelty search, invalidation, infringement analysis, FTO and technology scouting. He is enthusiastic towards new technology advancements, specifically in the field of 3D Printing, IoT, biomedical devices, and connected vehicles.

Apart from his technological interests, he has exhaustive exposure to IP matters related to technologies like Network Security, Intrusion Detection, Access Management Solutions, Wearable Devices, Mobile Device Management, Home Appliances, HVAC, ADAS, Tire Pressure Monitors, V2X, V2V, Driver Attribute Detectors, Vehicle Ad-hoc Networks, Electric Powertrains, Taxi Dispatch Systems, Sensor Fusion, Vehicle Autonomy, Winter Tires, Invasive and Non-Invasive Physiological Parameter Monitors, Invasive Drug Injectors, Subcutaneous Injectors, Surgical Staplers, Ventricular Assist Devices, Endotracheal intubation, Remote Patient Monitors, Firewall, Content Delivery Network, Data Encryption and Obfuscation and Digital Rights Management.

During Master’s, his work majorly revolved around 3D Printing based manufacturing of conventional machining tools, assistive robotics and IoT based physiological parameter monitoring. Some of his latest publications and pending patents are mentioned below:

  • “3D Printing: Adoptability, Assurance, IP and Consumer Concerns” IP Watchdog, October 2020

  • “Effect of Process Parameters on Shrinkage of Acrylonitrile Butadiene Styrene Parts Fabricated by 3D Printing Process” International Conference on Physics and Mechanics of New Materials and Their Applications (PHENMA-2017), Jabalpur, October 2017, (Advanced Materials 2018, Book Chapter by Springer)

  • “Compatibility of Glass Materials with Silicon During Anodic Bonding for Diaphragm based MEMS Capacitive Sensor” Proceedings of International Conference on Advancements in Engineering and Technology (ICAET-2017), Sangrur, March 2017

  • “Towards Development of an Assistive Device for STS Transfer and Ambulation of Healthy Elderly”, 2018 M.E. Thesis, Thapar Institute of Engineering and Technology, Patiala

  • Door Handle, Indian Industrial Design Patent, Application Number:334009-001

  • Flexible Carrier for a Vehicle, Indian Utility Patent, Application Number: 202141045928

Sukhdeep's educational background includes:

  • Masters of Engineering in CAD/CAM Engineering from Thapar Institute of Engineering and Technology, Patiala, Punjab, India

  • Bachelors of Technology in Mechanical Engineering from Punjabi University, Patiala, Punjab, India